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Wafer Grinding Introduction

Surface Grinding in Silicon Wafer Manufacturing

Surface Grinding in Silicon Wafer Manufacturing

grinding wheel is offset a distance of the radius relative to the axis of rotation for wafer. During grinding, the grinding wheel and wafer rotate about their own axes of rotation simultaneously, and the wheel is fed towards the wafer along its axis. Single crystal silicon wafers of ?50mm, 200mm and

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Precision Grinding of Ultra-Thin Quartz Wafers

Precision Grinding of Ultra-Thin Quartz Wafers

Wafer Grinding Once the vacuum chuck has been machined under controlled grinding conditions, the wafer can be mounted and ground. Since the wafer is very thin, its back surface conforms closely to the chuck surface. The front surface is then ground as flat as possible, again using real-time feed-back control and a ref-erence flat. •

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Grinding of silicon wafers: A review from historical

Grinding of silicon wafers: A review from historical

wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two other silicon machining processes (slicing and polishing)

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Semiconductor Grinding, Lapping, & Polishing Systems

Semiconductor Grinding, Lapping, & Polishing Systems

Introduction. The capability to quickly and efficiently produce quality wafer surfaces in pilot line and R & D applications is key in today’s rapidly changing semiconductor environment. The engineers at Engis have developed a grind straight to polish process to meet these challenges for most compound semiconductor materials should that be bulk wafer or back thinning applications

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Wafer Grinding Wheels-KINIK COMPANY

Wafer Grinding Wheels-KINIK COMPANY

Introduction. Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers etc. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a

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Dicing before Grinding: A Robust Wafer Thinning and

Dicing before Grinding: A Robust Wafer Thinning and

process step. At wafer back grinding, BG tape serves as a cushion and ensures that wafers are properly vacuumed throughout the process. Once the target wafer thickness was achieved, the wafer then proceeds to wafer mounting process. The grinded wafer is mounted onto a dicing tape or Dicing Die Attach Film (DDAF) and ring frame

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The effects of edge trimming - DISCO

The effects of edge trimming - DISCO

which has been adopted for improving yield when performing ultra-thin wafer grinding. 1. Introduction During wafer ultra-thinning, the edges chipping because of the rounded shape of the wafer's outer edges induces wafer breaking. Therefore, a process called edge trimming is employed to

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TAIKO Process | TAIKO Process | Grinding | Solutions

TAIKO Process | TAIKO Process | Grinding | Solutions

The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. ... Lower introduction of particles due to integrated

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Wafer GrinderMarket Size 2021 Trend and Opportunities

Wafer GrinderMarket Size 2021 Trend and Opportunities

1.1 Wafer Grinder Introduction 1.2 Market Analysis by Type 1.2.1 Wafer Edge Grinder 1.2.2 Wafer Surface Grinder 1.3 Market Analysis by Applications 1.3.1 Silicon Wafer 1.3.2 Compound Semiconductors 1.4 Market Analysis by Regions 1.4.1 North America (United States, Canada and Mexico) 1.4.1.1 United States Market States and Outlook (2014-2024)

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Solar plus company Wafer Grinding Tape, Dicing Tape

Solar plus company Wafer Grinding Tape, Dicing Tape

Product Introduction. ♠ High flatness and great elongagtion for wafer back grinding / thinning protection, substrate cutting. ♠ Lift-off cleaning. ♠ Film peeler, film remover. Product Code Product Description Physical Property Applications; POL143: PO Film:

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Wafer Grinding Tapes Market Size Research 2021- New

Wafer Grinding Tapes Market Size Research 2021- New

Aug 11, 2021 3.2 Company 2 Wafer Grinding Tapes Business Introduction. 3.2.1 Company 2 Wafer Grinding Tapes Shipments, Price, Revenue and Gross profit 2015-2020

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The Applications of a TAIKO Wafer | Grinding | Solutions

The Applications of a TAIKO Wafer | Grinding | Solutions

The Applications of a TAIKO Wafer. The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer. By leaving this edge ring, it is possible to reduce the risks of wafer breakage or edge chipping

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Revasum | Semiconductor Grinding Technology

Revasum | Semiconductor Grinding Technology

Revasum’s 7AF-HMG grinding solution extends wheel life by nine times, increases uptime by 10%, boosts wafer output by 15 percent, and reduces the cost of ownership by seven times. With a return on investment of less than one year, the choice for SiC grinding is clear: choose the 7AF-HMG. All pre-owned equipment goes through a rigorous

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Study into grinding force in back grinding of wafer with

Study into grinding force in back grinding of wafer with

Aug 18, 2020 Silicon wafers are the most widely used substrate material in integrated circuit manufacturing [1,2,3].Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers, and its working principle is shown in Fig. 1.Different from conventional back grinding, the BGWOR process only grinds the inner area of the silicon wafer and leaves a rim

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